| No. |
Part Name |
Description |
Manufacturer |
| 61 |
HCS320 |
The HCS320 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS320 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 62 |
HCS360 |
The HCS360 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS360 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 63 |
HCS361 |
The HCS361 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS361 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 64 |
HCS362 |
The HCS362 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS362 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 65 |
HCS365 |
The HCS365 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS365 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 66 |
HCS370 |
The HCS370 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS370 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low |
Microchip |
| 67 |
IC PACKAGES |
Plastic Package Outlines, P-DIP, 4, 6 8, 14 pins, 20A DIN 41866 |
Siemens |
| 68 |
ICS280 |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
| 69 |
ICS280PG |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
| 70 |
ICS280PGI |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
| 71 |
ICS280PGILF |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
| 72 |
ICS280PGLF |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) |
Integrated Circuit Solution Inc |
| 73 |
PACKAGE OUTLINES |
Package Outlines, Shape and dimensions |
Intersil |
| 74 |
PACKAGE OUTLINES |
Package Outlines, Shape and dimensions |
Intersil |
| 75 |
S-31 |
PACKAGE OUTLINE DRAWINGS |
Sprague |
| 76 |
SECTION9 |
Orderding Information and package outlines from FAIRCHILD TTL DATA BOOK 1978 |
Fairchild Semiconductor |
| 77 |
SIP-9 |
Package Outline Dimensions |
Motorola |
| 78 |
SO-14 |
Package Outline Dimensions |
Motorola |
| 79 |
SO-16L |
Package Outline Dimensions |
Motorola |
| 80 |
SO-8 |
Package Outline Dimensions |
Motorola |
| 81 |
SOP-8 |
Package Outline Dimensions |
Motorola |
| 82 |
SOT109-1 |
Package outline |
Philips |
| 83 |
SOT263 |
Package outline |
Philips |
| 84 |
SOT27-1 |
Package outline |
Philips |
| 85 |
SOT416 |
Package outline |
Philips |
| 86 |
SOT527-1 |
Package outline |
Philips |
| 87 |
TO-1 |
TO1 Package Outlines |
Newmarket Transistors NKT |
| 88 |
TO-1 |
PACKAGE OUTLINE DRAWINGS |
Sprague |
| 89 |
TO-100 |
Package Outline Dimensions |
Motorola |
| 90 |
TO-116 |
Package Outline Dimensions |
Motorola |
| | | |
