No. |
Part Name |
Description |
Manufacturer |
61 |
EP2F-B3G2TT |
HIGH HEAT RESISTIVITY |
NEC |
62 |
EP2F-B3G3 |
HIGH HEAT RESISTIVITY |
NEC |
63 |
EP2F-B3G3T |
HIGH HEAT RESISTIVITY |
NEC |
64 |
EP2F-B3G3TT |
HIGH HEAT RESISTIVITY |
NEC |
65 |
EP2S-B3G1 |
LOW SOUND PRESSURE |
NEC |
66 |
EP2S-B3G1T |
LOW SOUND PRESSURE |
NEC |
67 |
EP2S-B3G1TT |
LOW SOUND PRESSURE |
NEC |
68 |
EP2S-B3G2 |
LOW SOUND PRESSURE |
NEC |
69 |
EP2S-B3G2T |
LOW SOUND PRESSURE |
NEC |
70 |
EP2S-B3G2TT |
LOW SOUND PRESSURE |
NEC |
71 |
EP2S-B3G3 |
LOW SOUND PRESSURE |
NEC |
72 |
EP2S-B3G3T |
LOW SOUND PRESSURE |
NEC |
73 |
EP2S-B3G3TT |
LOW SOUND PRESSURE |
NEC |
74 |
EP2S-B3G4 |
LOW SOUND PRESSURE |
NEC |
75 |
EP2S-B3G4T |
LOW SOUND PRESSURE |
NEC |
76 |
EP2S-B3G4TT |
LOW SOUND PRESSURE |
NEC |
77 |
EP2S-B3G5 |
LOW SOUND PRESSURE |
NEC |
78 |
EP2S-B3G5T |
LOW SOUND PRESSURE |
NEC |
79 |
EP2S-B3G5TT |
LOW SOUND PRESSURE |
NEC |
80 |
HC05JB3GRS/H |
68HC05JB3 and 68HC705JB3 General Release Specification |
Motorola |
81 |
M30621M8-5B3GP |
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER |
Mitsubishi Electric Corporation |
82 |
M95320-MB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
83 |
M95320-RMB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
84 |
M95320-SMB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
85 |
M95320-WMB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
86 |
M95640-MB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
87 |
M95640-RMB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
88 |
M95640-SMB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
89 |
M95640-WMB3G |
32Kbit and 64Kbit Serial SPI Bus EEPROMs With High Speed Clock |
ST Microelectronics |
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