| No. |
Part Name |
Description |
Manufacturer |
| 61 |
117-99-656-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 62 |
117-99-664-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 63 |
117-99-668-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 64 |
117-99-764-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 65 |
217-91-764-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 66 |
217-93-764-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 67 |
217-97-764-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 68 |
217-99-764-41-005 |
Shrinkdip sockets Open and closed frame Solder tail |
Precid-Dip Durtal |
| 69 |
ATUM-XX |
HEAT SHRINK BLK 1.2M |
Tyco Electronics |
| 70 |
B, H |
General Purpose, High Voltage, Radial Lug or Axial Lead, Supplied with a Mylar Heat-Shrink Protective Sleeve |
Vishay |
| 71 |
BU7961GUW |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 72 |
BU7961GUW-E2 |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 73 |
BU7962GUW |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 74 |
BU7962GUW-E2 |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 75 |
BU7963GUW |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 76 |
BU7963GUW-E2 |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 77 |
BU7964GUW |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 78 |
BU7964GUW-E2 |
MSDL (Mobile Shrink Data Link) Transceivers for Mobile Phones |
ROHM |
| 79 |
D3041N |
Netz-Gleichrichterdiode Rectifier Diode |
Eupec GmbH |
| 80 |
D758N |
Leistungsgleichrichterdioden Power Rectifier Diodes |
Eupec GmbH |
| 81 |
M24.173B |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) |
Intersil |
| 82 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 83 |
MQA24 |
24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 84 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
| 85 |
MS48A |
48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 86 |
MS56A |
56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 87 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 88 |
MSA24 |
24 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 89 |
MSA28 |
28-Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 90 |
MTA20 |
20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I |
National Semiconductor |
| | | |
