No. |
Part Name |
Description |
Manufacturer |
61 |
AWT1921S11 |
Integrated High Power Amp 1610 MHz Advanced Product information |
Anadigics Inc |
62 |
AWT921S11 |
Integrated High Power Amp 900 MHz Advanced Product information |
Anadigics Inc |
63 |
BSM200GB170DLC |
Technical Information |
Eupec GmbH |
64 |
C20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
65 |
C20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
66 |
C20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
67 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
68 |
C30 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
69 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
70 |
C504D |
12L digital processor for 14 bit wide output information and additional functions |
RFT |
71 |
CIRCULATORS |
General informations, Terms and definitions, standard test specifications |
Philips |
72 |
CMOS |
Integrated Circuit Chips - General Information |
Analog Devices |
73 |
CONSUMER-II |
STPC CONSUMER-II DATASHEET / X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP |
ST Microelectronics |
74 |
CURRENT |
Photocoupler - Supplementary Information |
TOSHIBA |
75 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
76 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
77 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
78 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
79 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
80 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
81 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
82 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
83 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
84 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
85 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
86 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
87 |
DC-24C |
SIZE-BRAZED DIP DC24C Packaging Information |
Hitachi Semiconductor |
88 |
DC-28B |
SIZE-BRAZED DIP DC28B Packaging Information |
Hitachi Semiconductor |
89 |
DCR0121SF64 |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
90 |
DCR1021SF |
Phase Control Thyristor Target Information |
Dynex Semiconductor |
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