No. |
Part Name |
Description |
Manufacturer |
61 |
14 LEAD CERDIP(JD) |
PACKAGE OUTLINES |
Intersil |
62 |
14 LEAD FLATPACK(FD-1) |
PACKAGE OUTLINES |
Intersil |
63 |
14 LEAD FLATPACK(FD-2) |
PACKAGE OUTLINES |
Intersil |
64 |
14 LEAD PLASTIC(PD) |
PACKAGE OUTLINES |
Intersil |
65 |
1401 |
Bulk Metal Foil Technology, 3 Pin Transistor Outline Hermetic Resistor Network |
Vishay |
66 |
1403 |
Bulk Metal Foil Technology, 4 Pin Transistor Outline Hermetic Resistor Network, Smallest Available Miniature Hermetically-Sealed Network |
Vishay |
67 |
1413 |
Bulk Metal Foil Technology, 8 Pin Transistor Outline Hermetic Resistor Network, Ideal for Uncomplicated Networks |
Vishay |
68 |
1416-100 |
High Power silicon bipolar NPN transistor designed for L-Band radar pulsed output and driver applications |
SGS Thomson Microelectronics |
69 |
1416-200 |
High Power silicon bipolar NPN transistor designed for L-Band radar pulsed output and driver applications |
SGS Thomson Microelectronics |
70 |
1417 |
Bulk Metal Foil Technology, 8 Pin Transistor Outline Hermetic Resistor Network, Alternative Layout to Model 1413 |
Vishay |
71 |
1417 |
Bulk Metal Foil Technology, 8 Pin Transistor Outline Hermetic Resistor Network, Alternative Layout to Model 1413 |
Vishay |
72 |
1419 |
Bulk Metal Foil Technology, 10 Pin Transistor Outline Hermetic Resistor Network, Largest R Capacity of the Smaller TO Series |
Vishay |
73 |
1421 |
Bulk Metal Foil Technology, 12 Pin Transistor Outline Hermetic Resistor Network, Suitable for Ladder Networks, Ideal when Power Dissipation is a Consideration |
Vishay |
74 |
1422 |
Bulk Metal Foil Technology, 16 Pin Transistor Outline Hermetic Resistor Network, Suitable for Ladder Networks, Ideal when Power Dissipation is a Consideration |
Vishay |
75 |
1460 |
Operational Amplifier - High Speed / VMOS Output |
TelCom Semiconductor |
76 |
152-02 |
Outline dimensions case |
Motorola |
77 |
15AM |
Motor Protector/Thermal Cut-out |
Texas Instruments |
78 |
16 LEAD CERAMIC(DE) |
PACKAGE OUTLINES |
Intersil |
79 |
16 LEAD CERDIP (JE) |
PACKAGE OUTLINES |
Intersil |
80 |
16 LEAD FLATPACK (FE2) |
PACKAGE OUTLINES |
Intersil |
81 |
16MV4700WX |
N-Channel FET Synchronous Buck Regulator Controller for Low Output Voltages |
National Semiconductor |
82 |
16MV680WG |
N-Channel FET Synchronous Buck Regulator Controller for Low Output Voltages |
National Semiconductor |
83 |
197-01 |
Outline dimensions case |
Motorola |
84 |
1C1202 |
CASE OUTLINES |
IPRS Baneasa |
85 |
1C1203 |
CASE OUTLINES |
IPRS Baneasa |
86 |
1G-106 |
TRANSITRON 1G106 OUTLINE |
Transitron Electronic |
87 |
1G-111 |
TRANSITRON 1G111 OUTLINE |
Transitron Electronic |
88 |
1G-114 |
TRANSITRON 1G114 OUTLINE |
Transitron Electronic |
89 |
1G-118 |
1G118 ceramic outline |
Transitron Electronic |
90 |
1G-118 EPOXY |
TRANSITRON 1G118 EPOXY OUTLINE |
Transitron Electronic |
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