| No. |
Part Name |
Description |
Manufacturer |
| 61 |
NDL7514P1C |
InGaAsP STRAINED MQW DC-PBH PULSED LASER DIODE MODULE 1310nm OTDR APPLICATION |
NEC |
| 62 |
NDL7515P1C |
InGaAsP MQW DC-PBH PULSED LASER DIODE MODULE 1 310 nm OTDR APPLICATION |
NEC |
| 63 |
NDL7553P1C |
InGaAsP STRAINED MQW DC-PBH PULSED LASER DIODE MODULE 1550nm OTDR APPLICATION |
NEC |
| 64 |
NDL7563P1C |
InGaAsP STRAINED MQW DC-PBH PULSED LASER DIODE MODULE 1550nm OTDR APPLICATION |
NEC |
| 65 |
NDL7564P1C |
InGaAsP STRAINED MQW DC-PBH PULSED LASER DIODE MODULE 1550nm OTDR APPLICATION |
NEC |
| 66 |
NDL7565P1C |
InGaAsP MQW DC-PBH PULSED LASER DIODE MODULE 1 550 nm OTDR APPLICATION |
NEC |
| 67 |
NDL7603P1C |
1 310 nm OPTICAL FIBER COMMUNICATIONS InGaAsP MQW-DFB LASER DIODE COAXIAL MODULE |
NEC |
| 68 |
NDL7605P1C |
1 310 nm OPTICAL CATV RETURN PATH APPLICATIONS InGaAsP MQW DFB LASER DIODE MODULE WITH ISOLATOR |
NEC |
| 69 |
NDL7620P1C |
1 310 nm OPTICAL FIBER COMMUNICATIONS InGaAsP STRAINED MQW-DFB LASER DIODE COAXIAL MODULE FOR 2.5 Gb/s |
NEC |
| 70 |
NDL7701P1C |
1 550 nm OPTICAL FIBER COMMUNICATIONS InGaAsP STRAINED MQW DFB DC-PBH LASER DIODE MODULE |
NEC |
| 71 |
NDL7705P1C |
1 500 nm OPTICAL FIBER COMMUNICATIONS InGaAsP MQW-DFB LASER DIODE COAXIAL MODULE |
NEC |
| 72 |
SVSP1C105M |
Surface mount resin molded, Ultra miniaturized chip |
NEC |
| 73 |
SVSP1C225M |
Resign molded chip ultra miniaturized |
NEC |
| 74 |
SVSP1C334M |
Surface mount resin molded, Ultra miniaturized chip |
NEC |
| 75 |
SVSP1C335M |
Resign molded chip ultra miniaturized |
NEC |
| 76 |
SVSP1C474M |
Surface mount resin molded, Ultra miniaturized chip |
NEC |
| 77 |
SVSP1C684M |
Surface mount resin molded, Ultra miniaturized chip |
NEC |
| 78 |
TCFGP1C106K8R |
Chip tantalum capacitors with open-function built-in |
ROHM |
| 79 |
TCFGP1C106M8R |
Chip tantalum capacitors with open-function built-in |
ROHM |
| 80 |
TCP1C105M8R |
Tantalum Capacitors (Standard) |
ROHM |
| 81 |
TCSP1C226M8R |
Tantalum Capacitors (Bottom surface electrode : Extra large capacitance) |
ROHM |
| 82 |
TCSP1C336M8R |
Tantalum Capacitors (Bottom surface electrode : Extra large capacitance) |
ROHM |
| 83 |
TCTP1C106M8R |
Tantalum Capacitors (Bottom surface electrode : Large capacitance) |
ROHM |
| 84 |
TESVSP1C225M8R |
Resign molded chip ultra miniaturized |
NEC |
| 85 |
TESVSP1C335M8R |
Resign molded chip ultra miniaturized |
NEC |
| 86 |
XP1C301 |
Composite Device - Composite Transistors |
Panasonic |
| | | |
