| No. |
Part Name |
Description |
Manufacturer |
| 61 |
ATS674LSETN-HT-T |
ATS673/4 Self Calibrating TPOS Gear Tooth Sensor Optimized for Automotive Cam Sensing Applications |
Allegro MicroSystems |
| 62 |
ATS674LSETN-LT |
ATS673/4 Self Calibrating TPOS Gear Tooth Sensor Optimized for Automotive Cam Sensing Applications |
Allegro MicroSystems |
| 63 |
ATS674LSETN-LT-T |
ATS673/4 Self Calibrating TPOS Gear Tooth Sensor Optimized for Automotive Cam Sensing Applications |
Allegro MicroSystems |
| 64 |
BAS31 |
Dual In-Series General-Purpose Controlled-Avalanche Diode |
Vishay |
| 65 |
BD202 |
Silicon Complementary Transistors General Purpose Amplifier, Switch |
NTE Electronics |
| 66 |
BF516 |
Epitaxial planar PNP transistor, intended as general purpose amplifier and oscillator up to 1GHz |
SGS-ATES |
| 67 |
BY249 |
Rectifier diodes general purpose |
Philips |
| 68 |
BY249-300 |
Rectifier diodes general purpose |
Philips |
| 69 |
BY249-600 |
Rectifier diodes general purpose |
Philips |
| 70 |
BY249-800 |
Rectifier diodes general purpose |
Philips |
| 71 |
BY249SERIES |
Rectifier Diodes general purpose |
Philips |
| 72 |
C20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 73 |
C20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 74 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 75 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 76 |
CBTL01023GM |
3.3 V, one differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
NXP Semiconductors |
| 77 |
CBTL02042ABQ |
3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
NXP Semiconductors |
| 78 |
CBTL02042BBQ |
3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
NXP Semiconductors |
| 79 |
CBTL02043ABQ |
3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
NXP Semiconductors |
| 80 |
CBTL02043BBQ |
3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
NXP Semiconductors |
| 81 |
CBTL04082ABS |
3.3 V, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
NXP Semiconductors |
| 82 |
CBTL04082BBS |
3.3 V, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
NXP Semiconductors |
| 83 |
CBTL04083ABS |
3.3 V, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
NXP Semiconductors |
| 84 |
CBTL04083BBS |
3.3 V, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
NXP Semiconductors |
| 85 |
CFY27 |
HiRel Ku-Band GaAs General Purpose MESFET |
Infineon |
| 86 |
CFY27-38 |
HiRel Ku-Band GaAs General Purpose MESFET |
Infineon |
| 87 |
CFY27-P |
HiRel Ku-Band GaAs General Purpose MESFET |
Infineon |
| 88 |
CGY41 |
HiRel L- and S-Band GaAs General Purpose Amplifier |
Infineon |
| 89 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 90 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
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