| No. |
Part Name |
Description |
Manufacturer |
| 661 |
Heatsink U1/113 |
Dimensions and drawings |
IPRS Baneasa |
| 662 |
HF-28 |
Package - Dimensional Outlines |
RCA Solid State |
| 663 |
HF-31 |
Package - Dimensional Outlines |
RCA Solid State |
| 664 |
HF-32 |
Package - Dimensional Outlines |
RCA Solid State |
| 665 |
HF-36 |
Package - Dimensional Outlines |
RCA Solid State |
| 666 |
HF-40 |
Package - Dimensional Outlines |
RCA Solid State |
| 667 |
HF-41 |
Package - Dimensional Outlines |
RCA Solid State |
| 668 |
HF-44 |
Package - Dimensional Outlines |
RCA Solid State |
| 669 |
HF-46 |
Package - Dimensional Outlines |
RCA Solid State |
| 670 |
HF-47 |
Package - Dimensional Outlines |
RCA Solid State |
| 671 |
HF-50 |
Package - Dimensional Outlines |
RCA Solid State |
| 672 |
HF-55 |
Package - Dimensional Outlines |
RCA Solid State |
| 673 |
HF-56 |
Package - Dimensional Outlines |
RCA Solid State |
| 674 |
HFBR-0310 |
HFBR-0310 · Evaluation Kit for Proprietary Point-to-Point and Distance Extension for Applications up to 155 MBd |
Agilent (Hewlett-Packard) |
| 675 |
HLP-11 |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
| 676 |
HLP-8/GP13 |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
| 677 |
HSIP-B12 |
Case shape and dimensions |
ROHM |
| 678 |
HSIP10 |
Case shape and dimensions |
ROHM |
| 679 |
HSOP24 |
Case shape and dimensions |
ROHM |
| 680 |
HSOP25 |
Case shape and dimensions |
ROHM |
| 681 |
HSOP28 |
Case shape and dimensions |
ROHM |
| 682 |
HSP48908 |
Two Dimensional Convolver |
Intersil |
| 683 |
HSP48908GC-20 |
Two Dimensional Convolver |
Intersil |
| 684 |
HSP48908GC-32 |
Two Dimensional Convolver |
Intersil |
| 685 |
HSP48908JC-20 |
Two Dimensional Convolver |
Intersil |
| 686 |
HSP48908JC-32 |
Two Dimensional Convolver |
Intersil |
| 687 |
HSP48908VC-20 |
Two Dimensional Convolver |
Intersil |
| 688 |
HSP48908VC-32 |
Two Dimensional Convolver |
Intersil |
| 689 |
HSP48908_883 |
Two Dimensional Convolver |
Intersil |
| 690 |
I2PAK |
I2PAK Package Dimensions |
Fairchild Semiconductor |
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