| No. |
Part Name |
Description |
Manufacturer |
| 6871 |
AMR2805D |
Hi-Rel DC-DC Rad-Tolerant Dual Converter in a AMR package |
International Rectifier |
| 6872 |
AMR2805S |
Hi-Rel DC-DC Rad-Tolerant Single Converter in a AMR package |
International Rectifier |
| 6873 |
AMR2812D |
Hi-Rel DC-DC Rad-Tolerant Dual Converter in a AMR package |
International Rectifier |
| 6874 |
AMR2812S |
Hi-Rel DC-DC Rad-Tolerant Single Converter in a AMR package |
International Rectifier |
| 6875 |
AMR2815D |
Hi-Rel DC-DC Rad-Tolerant Dual Converter in a AMR package |
International Rectifier |
| 6876 |
AMR2815S |
Hi-Rel DC-DC Rad-Tolerant Single Converter in a AMR package |
International Rectifier |
| 6877 |
AMT8310 |
The ANADIGICS AMT8310, packaged in a 4 pin TO-46 lens can, is a 3.3 V integrated photodetector and transimpedance amplifier (TIA) ... |
Anadigics Inc |
| 6878 |
AMT8312 |
The ANADIGICS AMT8312, packaged in a 5 pin TO-46 lens can, is a 3.3 V integrated photodetector and transimpedance amplifier (TIA) ... |
Anadigics Inc |
| 6879 |
AMT8410 |
The ANADIGICS AMT8410, packaged in a TO46 lens can, is a 3.3 V intergrated photodector and transimpedance amplifier(TIA) used to ... |
Anadigics Inc |
| 6880 |
AN-5026 |
Using BGA Packages |
Fairchild Semiconductor |
| 6881 |
AN1227 |
IMPROVED RF MOSFET RELIABILITY THROUGH PACKAGING ENHANCEMENTS |
SGS Thomson Microelectronics |
| 6882 |
AN1233 |
LDMOS PACKAGES |
SGS Thomson Microelectronics |
| 6883 |
AN1235 |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE |
SGS Thomson Microelectronics |
| 6884 |
AN1294 |
POWERSO-10RF: THE FIRST TRUE RF POWER SMD PACKAGE |
SGS Thomson Microelectronics |
| 6885 |
AN257 |
THERMAL CHARACTERISTICS OF THE MULTIWATT PACKAGE |
SGS Thomson Microelectronics |
| 6886 |
AN258 |
THERMAL CHARACTERISTICS OF THE PENTAWATT/HEPTAWATT PACKAGES |
SGS Thomson Microelectronics |
| 6887 |
AN260 |
HANDLING AND MOUNTING ICS IN PLASTIC POWER PACKAGES |
SGS Thomson Microelectronics |
| 6888 |
AN577 |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE |
SGS Thomson Microelectronics |
| 6889 |
AN6914UBS |
Industrial Surface Mounting Package Comparator |
Panasonic |
| 6890 |
AN801 |
Designing with LITTLE FOOT® Power MOSFETs in Surface-Mount (SO-8) Packages |
Vishay |
| 6891 |
AN899 |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION |
SGS Thomson Microelectronics |
| 6892 |
AN978 |
ST7 - KEY FEATURES OF THE STVD7 ST7 VISUAL DEBUG PACKAGE |
SGS Thomson Microelectronics |
| 6893 |
AN983 |
ST7 - KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE |
SGS Thomson Microelectronics |
| 6894 |
AND124G |
Standard LED T-1 Package (3 mm) |
AND Displays |
| 6895 |
AND180CRP |
GaAlAs Red Light Emission T-1 3/4 Package (5 mm) |
AND Displays |
| 6896 |
AND185HAP |
InGaAlP High Brightness Amber Light Emission T-1 3/4 Package (5 mm) |
AND Displays |
| 6897 |
AND233GCP |
GaP Green Light Emission Special Shape Package |
AND Displays |
| 6898 |
AP9106 |
8-Channels Switch for Multi-Cells Li+/Polymer Battery Pack |
Diodes |
| 6899 |
AP9107 |
Analog Front-end Chip for Multi-cells Li+ Battery Pack |
Diodes |
| 6900 |
APD Series |
Silicon PIN Diodes, Packaged and Bondable (Chip) |
Skyworks Solutions |
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