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Datasheets for AR I

Datasheets found :: 1734
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No. Part Name Description Manufacturer
691 IR2233S 3 Phase Driver, Separate High and Low Side Inputs, Overcurrent Comparator, Latching Fault Logic, Fault Clear Input, Synchronized Shutdown Input, 200ns Deadtime in a 28-lead SOIC package International Rectifier
692 IR2235 3 Phase Driver, Separate High and Low Side Inputs, Overcurrent Comparator, Latching Fault Logic, Fault Clear Input, Synchronized Shutdown Input, 200ns Deadtime in a 28-pin DIP package International Rectifier
693 IR2235J 3 Phase Driver, Separate High and Low Side Inputs, Overcurrent Comparator, Latching Fault Logic, Fault Clear Input, Synchronized Shutdown Input, 200ns Deadtime in a mod. 44-lead PLCC package International Rectifier
694 IR2235S 3 Phase Driver, Separate High and Low Side Inputs, Overcurrent Comparator, Latching Fault Logic, Fault Clear Input, Synchronized Shutdown Input, 200ns Deadtime in a 28-lead SOIC package International Rectifier
695 ISL5761_2IA 210MHz; 10-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. Intersil
696 ISL5761_2IB 210MHz; 10-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. Intersil
697 ISL5861_2IA 210MHz; 3.6V; 12-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. Intersil
698 ISL5861_2IB 210MHz; 3.6V; 12-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. Intersil
699 ISL5961_2IA 3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. Intersil
700 ISL5961_2IB 3.6V; 14-bit, +3.3V, 130/210+MSPS, commlink high speed D/A converter. For cellular infrastructure- single or multi-carrier: IS-136, IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA, BWA structure, etc. Intersil
701 ISO100 Optically-Coupled Linear ISOLATION AMPLIFIER Burr Brown
702 ISO100AP Optically-Coupled Linear ISOLATION AMPLIFIER Burr Brown
703 ISO100BP Optically-Coupled Linear ISOLATION AMPLIFIER Burr Brown
704 ISO100CP Optically-Coupled Linear ISOLATION AMPLIFIER Burr Brown
705 JSFC2300 Linear integrated circuit - Voltage regulator (chips) SESCOSEM
706 JSFC2301A Linear integrated circuit - Operational amplifier (chips) SESCOSEM
707 JSFC2305 Linear integrated circuit - Voltage regulator (chips) SESCOSEM
708 JSFC2307 Linear integrated circuit - Operational amplifier (chips) SESCOSEM
709 JSFC2309C Linear integrated circuit - Operational amplifier (chips) SESCOSEM
710 JSFC2710C Linear integrated circuit - Comparator (chips) SESCOSEM
711 JSFC2711C Linear integrated circuit - Comparator (chips) SESCOSEM
712 JSFC2723C Linear integrated circuit - Voltage regulator (chips) SESCOSEM
713 JSFC2741C Linear integrated circuit - Operational amplifier (chips) SESCOSEM
714 JSFC2790C Linear integrated circuit - LF amplifier (chip) SESCOSEM
715 JSFC2861C Linear integrated circuit - Operational amplifier (chips) SESCOSEM
716 KA2153 LINEAR INTEGRATED CIRCUIT Samsung Electronic
717 KA2154 LINEAR INTEGRATED CIRCUIT Samsung Electronic
718 KA2155 LINEAR INTEGRATED CIRCUIT Samsung Electronic
719 KA2156 LINEAR INTEGRATED CIRCUIT Samsung Electronic
720 KA2264D LINEAR INTEGRATED CIRCUIT Samsung Electronic


Datasheets found :: 1734
Page: | 20 | 21 | 22 | 23 | 24 | 25 | 26 | 27 | 28 |



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