No. |
Part Name |
Description |
Manufacturer |
7141 |
MR508 |
Miniature size, axial lead mounted standard recovery power rectifiers 3A 800V |
Motorola |
7142 |
MR510 |
Miniature size, axial lead mounted standard recovery power rectifiers 3A 1000V |
Motorola |
7143 |
MR750 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7144 |
MR750-D |
High Current Lead Mounted Rectifiers |
ON Semiconductor |
7145 |
MR751 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7146 |
MR752 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7147 |
MR754 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7148 |
MR756 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7149 |
MR758 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7150 |
MR760 |
HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION |
Motorola |
7151 |
MRF1946A |
Application Note - A Cost Effective VHF Amplifier For Land Mobile Radios |
Motorola |
7152 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
7153 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
7154 |
MSA24 |
24 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
7155 |
MSA28 |
28-Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
7156 |
MSK4250 |
10 AMP, 75V, H-BRIDGE MOSFET BRUSHED MOTOR CONTROLLER |
M.S. Kennedy Corp. |
7157 |
MSK4250H |
10 AMP, 75V, H-BRIDGE MOSFET BRUSHED MOTOR CONTROLLER |
M.S. Kennedy Corp. |
7158 |
MSP-G240128DBCW-2N |
LCD MODULE |
etc |
7159 |
MTA20 |
20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I |
National Semiconductor |
7160 |
MTB24 |
24-Lead Molded Thin Shrink Small Outline Package |
National Semiconductor |
7161 |
MTC-S16205DFGHSAY |
LCD MODULE |
Microtips Technology |
7162 |
MTC-S16208XFYHSGY |
LCD MODULE SPECIFICATION FOR CUSTOMERS APPROVAL |
Microtips Technology |
7163 |
MTC08 |
8-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7164 |
MTC14 |
14 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7165 |
MTC16 |
20-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7166 |
MTC20 |
20 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7167 |
MTC24 |
24 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7168 |
MTD48 |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7169 |
MTD56 |
56 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
7170 |
MTV038N |
On-screen-display controller for CRT/LCD monitor |
MYSON TECHNOLOGY |
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