No. |
Part Name |
Description |
Manufacturer |
7501 |
SAA4994 |
Field and line rate converter with noise reduction |
Philips |
7502 |
SAA4994H |
Field and line rate converter with noise reduction |
Philips |
7503 |
SAA4994H/V1 |
SAA4994H; Field and line rate converter with noise reduction |
Philips |
7504 |
SAA4997H |
VErtical Reconstruction IC VERIC for PALplus |
Philips |
7505 |
SAA4998H |
Field and line rate converter with noise reduction and embedded memory |
Philips |
7506 |
SAB2021 |
Instruction encoder |
mble |
7507 |
SG6741A |
Critical / Boundary Conduction Mode (CrCM / BCM) PFC Controllers |
Fairchild Semiconductor |
7508 |
SG6961 |
Critical Conduction Mode PFC Controller |
Fairchild Semiconductor |
7509 |
SH7708 |
32-bit RISC (reduced instruction set computer) microcomputers |
Hitachi Semiconductor |
7510 |
SH7708R |
32-bit RISC (reduced instruction set computer) microcomputers |
Hitachi Semiconductor |
7511 |
SH7708S |
32-bit RISC (reduced instruction set computer) microcomputers |
Hitachi Semiconductor |
7512 |
SKS |
Fusible Type Carbon Film Resistors, Fusible resistor for constant voltage designed for over load protection, Special construction opens the resistor at a specified overload, Non inflammable coating, Defined switch-off behavior |
Vishay |
7513 |
SML-D12D1W |
Mini-mold Chip LED (I<sub>V</sub> rank reduction products) |
ROHM |
7514 |
SML-D12M1W |
Mini-mold Chip LED (I<sub>V</sub> rank reduction products) |
ROHM |
7515 |
SML-D12U1W |
Mini-mold Chip LED (I<sub>V</sub> rank reduction products) |
ROHM |
7516 |
SML-D12V1W |
Mini-mold Chip LED (I<sub>V</sub> rank reduction products) |
ROHM |
7517 |
SML-D12Y1W |
Mini-mold Chip LED (I<sub>V</sub> rank reduction products) |
ROHM |
7518 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
7519 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
7520 |
SOLDERING INSTRUCTIONS |
Soldering and installation instructions for Siemens semiconductors components |
Siemens |
7521 |
SOLDERING INSTRUCTIONS |
Soldering and installation instructions for Siemens semiconductors components |
Siemens |
7522 |
SOMC |
Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, |
Vishay |
7523 |
SOT-32 |
ACCESSORIES AND MOUNTING INSTRUCTIONS |
SGS-ATES |
7524 |
SOT-32 |
Accessories and Mounting Instructions for SOT-32 |
SGS-ATES |
7525 |
SOT-9 |
Accessories and Mounting Instructions for SOT-9 |
SGS-ATES |
7526 |
SPA02N80C3 |
for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ... |
Infineon |
7527 |
SPA03N60C3 |
for lowest Conduction Losses & fastest Switching |
Infineon |
7528 |
SPA04N50C3 |
for lowest Conduction Losses & fastest Switching |
Infineon |
7529 |
SPA04N60C2 |
for lowest Conduction Losses & fastest Switching |
Infineon |
7530 |
SPA04N60C3 |
for lowest Conduction Losses & fastest Switching |
Infineon |
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