| No. |
Part Name |
Description |
Manufacturer |
| 751 |
1N986B-1 |
METALLURGICALLY BONDED |
Compensated Devices Incorporated |
| 752 |
1N986B-1 |
METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
Microsemi |
| 753 |
1N98A |
Gold Bond Germanium Diode |
ITT Semiconductors |
| 754 |
1N98B |
GOLD BONDED GERMANIUM DIODES |
New Jersey Semiconductor |
| 755 |
1N99 |
Gold Bond Germanium Diode |
ITT Semiconductors |
| 756 |
1N99 |
GOLD BONDED GERMANIUM DIODES |
New Jersey Semiconductor |
| 757 |
1N994 |
8 V, 500 mA, gold bonded germanium diode |
BKC International Electronics |
| 758 |
1N994 |
Gold Bond Germanium Diode |
ITT Semiconductors |
| 759 |
1N995 |
15 V, 250 mA, gold bonded diode |
BKC International Electronics |
| 760 |
1N995 |
Gold Bond Germanium Diode |
ITT Semiconductors |
| 761 |
1N996 |
25 V, 500 mA, gold bonded germanium diode |
BKC International Electronics |
| 762 |
1N996 |
GOLD BOND GERMANIUM DIODE |
ITT Semiconductors |
| 763 |
1S73 |
Germanium GOLDBOND diode |
TOSHIBA |
| 764 |
1S73A |
Germanium GOLDBOND diode |
TOSHIBA |
| 765 |
1S77 |
Germanium Gold Bond for TV Horizontal Deflection Oscillator stage damper |
Hitachi Semiconductor |
| 766 |
1S77H |
Germanium Gold Bond Diode, intended for use in High Transfer Medium Speed Switching |
Hitachi Semiconductor |
| 767 |
1S78H |
Germanium Gold Bond Diode, intended for use in High Transfer Medium Speed Switching |
Hitachi Semiconductor |
| 768 |
1S79H |
Germanium Gold Bond Diode, intended for use in High Transfer Medium Speed Switching |
Hitachi Semiconductor |
| 769 |
24C01SC |
Note:This product has become 'Obsolete' and is no longer offered as a viable device for design. Please Consider 24LC01SC Instead The 24C01SC is a 1K bit Electrically Erasable PROM with bondpad positions optimized for smart card specific ap |
Microchip |
| 770 |
24C02SC |
The 24C02SC is a 2K bit Electrically Erasable PROM with bondpad positions optimized for smart card specific applications. The 24C02SC is organized as a single block of 256 x 8-bit memory with an I2C™ compatible 2-wire seria |
Microchip |
| 771 |
27C4096 |
256K X 16 ELECTRICALLY ERASABLE EPROM |
Winbond Electronics |
| 772 |
27E040T-12 |
512K*8 bits high speed, low power electrically erasable EPROM |
Winbond Electronics |
| 773 |
632P |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
| 774 |
632P103X2050 |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
| 775 |
632P103X5050 |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
| 776 |
632P103X9050 |
Film Capacitors Metalized Polycarbonate, Wrap-and-Fill |
Vishay |
| 777 |
632P104X9400 |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
| 778 |
632P105X9400 |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
| 779 |
632P123X9400 |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
| 780 |
632P124X9400 |
Film Capacitors Metalized Polycarbonate/ Wrap-and-Fill |
Vishay |
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