| No. |
Part Name |
Description |
Manufacturer |
| 751 |
CY7C4275V-10ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
| 752 |
CY7C4275V-15ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
| 753 |
CY7C4285V |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
| 754 |
CY7C4285V-10ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
| 755 |
CY7C4285V-15ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
| 756 |
CY7C4285V-25ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
| 757 |
CYDC128B16-55AXI |
1.8 V 4 K/8 K/16 K � 16 and 8 K/16 K � 8 ConsuMoBL Dual-Port Static RAM |
Cypress |
| 758 |
DE6491 |
CMX649-based wireless voice link demonstration kit that demonstrates CMX649 ADM. |
CONSUMER MICROCIRCUITS LIMITED |
| 759 |
DE8661 |
Demonstration board. Reference design for CMX866 V.22bis AT command modem. |
CONSUMER MICROCIRCUITS LIMITED |
| 760 |
DE8681 |
Demonstration and Evaluation Kit for CMX868 V.22bis Modem - provides a 'Socket-type Modem' |
CONSUMER MICROCIRCUITS LIMITED |
| 761 |
DE8781 |
Demonstration board. Reference design and evoluation tool for the CMX878 V.22bis modem plus DAA IC. |
CONSUMER MICROCIRCUITS LIMITED |
| 762 |
DE8782 |
Demonstration board. Reference design and evoluation tool for the CMX878 V.22bis modem plus DAA IC. |
CONSUMER MICROCIRCUITS LIMITED |
| 763 |
DESIGN CONSIDERATIONS |
Selecting TTL Logic, Noise Immunity, Electrical Characteristics, power consumption, absolute maximum ratings |
Motorola |
| 764 |
DH1A05000 |
High Insulation DIP Relay |
Global Components & Controls |
| 765 |
DH1A050D0 |
High Insulation DIP Relay |
Global Components & Controls |
| 766 |
DH1A12000 |
High Insulation DIP Relay |
Global Components & Controls |
| 767 |
DH1A120D0 |
High Insulation DIP Relay |
Global Components & Controls |
| 768 |
DH1A24000 |
High Insulation DIP Relay |
Global Components & Controls |
| 769 |
DH1A240D0 |
High Insulation DIP Relay |
Global Components & Controls |
| 770 |
DRV2624 |
Advance ERM/LRA Haptic Driver with Smart Loop and Low Power Consumption 9-DSBGA -40 to 85 |
Texas Instruments |
| 771 |
DRV2624YFFR |
Advance ERM/LRA Haptic Driver with Smart Loop and Low Power Consumption 9-DSBGA -40 to 85 |
Texas Instruments |
| 772 |
DRV2624YFFT |
Advance ERM/LRA Haptic Driver with Smart Loop and Low Power Consumption 9-DSBGA -40 to 85 |
Texas Instruments |
| 773 |
EC2 |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 774 |
EC2-12ND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 775 |
EC2-12SND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 776 |
EC2-24ND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 777 |
EC2-24SND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 778 |
EC2-3ND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 779 |
EC2-3SND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
| 780 |
EC2-4.5ND |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type |
NEC |
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