No. |
Part Name |
Description |
Manufacturer |
841 |
CXD9450-15 |
Single-Chip FaxEngine Product Family |
Conexant |
842 |
CXD9450-23 |
Single-Chip FaxEngine Product Family |
Conexant |
843 |
CXD9450-24 |
Single-Chip FaxEngine Product Family |
Conexant |
844 |
CXD9450-25 |
Single-Chip FaxEngine Product Family |
Conexant |
845 |
D08C |
8 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
846 |
D14D |
14 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
847 |
D14E |
14-Lead Hermetic Dual-In-Line Package |
National Semiconductor |
848 |
D16C |
16 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
849 |
D16D |
16-Lead Hybrid Metal Can Dual-In-Line Package |
National Semiconductor |
850 |
D18A |
18 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
851 |
D20A |
20 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
852 |
D20B |
20 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
853 |
D24C |
24 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
854 |
D24H |
24 Lead (0.300 in. Wide) Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
855 |
D24K |
24 Lead (0.400 in. Wide) Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
856 |
D28D |
28 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
857 |
D28F |
28 Lead Ceramic (0.400 Centers) Sidebraze, Dual-In-Line Package |
National Semiconductor |
858 |
D28G |
28 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
859 |
D28H |
28 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
860 |
D40C |
40 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
861 |
D48A |
48 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
862 |
D52A |
52 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
863 |
D64A |
64-Pin Dual-In Line Package |
Analog Devices |
864 |
DA32A |
32-Lead Ceramic (0.400 Centers) Sidebrazed Dual-In-Line Package |
National Semiconductor |
865 |
DA32B |
32-Lead Ceramic (0.600 Centers) Sidebraze Dual-In-Line Package Module |
National Semiconductor |
866 |
DLPT05-7 |
SURFACE MOUNT DATALINE PROTECTION DEVICE |
Diodes |
867 |
DLPT05W |
SURFACE MOUNT DATALINE PROTECTION DEVICE |
Diodes |
868 |
DP-16 |
DUAL-IN-LINE Plastic DP16 Packaging information |
Hitachi Semiconductor |
869 |
DP-18 |
DUAL-IN-LINE Plastic DP18 Packaging information |
Hitachi Semiconductor |
870 |
DP-20 |
DUAL-IN-LINE Plastic DP20 Packaging information |
Hitachi Semiconductor |
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