| No. |
Part Name |
Description |
Manufacturer |
| 841 |
CYM8301BV33-10BGI |
null : SRAM Modules |
Cypress |
| 842 |
CYM8301BV33-12BGC |
null : SRAM Modules |
Cypress |
| 843 |
CYM8301BV33-12BGI |
null : SRAM Modules |
Cypress |
| 844 |
CYM9288A |
null : SRAM Modules |
Cypress |
| 845 |
CYM9288APZ-60C |
null : SRAM Modules |
Cypress |
| 846 |
CYM9289B |
null : SRAM Modules |
Cypress |
| 847 |
CYM9289BPZ-60C |
null : SRAM Modules |
Cypress |
| 848 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 849 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 850 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 851 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 852 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 853 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 854 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 855 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 856 |
D15VD40 |
General Purpose Rectifiers / Twin Diode Modules |
Shindengen |
| 857 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 858 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 859 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 860 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 861 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 862 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 863 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 864 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 865 |
D2547P |
Wavelength-Selected High-Power D2587P-Type (with Wavelength Locker)/D2547P-Type Isolated DFB Laser Modules |
Agere Systems |
| 866 |
D2547P17 |
Wavelength-Selected High-Power D2587P-Type (with Wavelength Locker)/D2547P-Type Isolated DFB Laser Modules |
Agere Systems |
| 867 |
D2547P18 |
Wavelength-Selected High-Power D2587P-Type (with Wavelength Locker)/D2547P-Type Isolated DFB Laser Modules |
Agere Systems |
| 868 |
D2547P19 |
Wavelength-Selected High-Power D2587P-Type (with Wavelength Locker)/D2547P-Type Isolated DFB Laser Modules |
Agere Systems |
| 869 |
D2547P20 |
Wavelength-Selected High-Power D2587P-Type (with Wavelength Locker)/D2547P-Type Isolated DFB Laser Modules |
Agere Systems |
| 870 |
D2547P21 |
Wavelength-Selected High-Power D2587P-Type (with Wavelength Locker)/D2547P-Type Isolated DFB Laser Modules |
Agere Systems |
| | | |
