| No. |
Part Name |
Description |
Manufacturer |
| 9031 |
C1E |
Marking for UPC2709 part number, TO6 NEC package |
NEC |
| 9032 |
C1F |
Marking for UPC2710 part number, TO6 NEC package |
NEC |
| 9033 |
C1G |
Marking for UPC2711 part number, TO6 NEC package |
NEC |
| 9034 |
C1H |
Marking for UPC2712 part number, TO6 NEC package |
NEC |
| 9035 |
C1J |
Marking for UPC2713 part number, TO6 NEC package |
NEC |
| 9036 |
C1K |
Marking for UPC2714 part number, TO6 NEC package |
NEC |
| 9037 |
C1L |
Marking for UPC2715 part number, TO6 NEC package |
NEC |
| 9038 |
C1M |
Marking for UPC2723 part number, TO6 NEC package |
NEC |
| 9039 |
C1P |
Marking for UPC2726 part number, TO6 NEC package |
NEC |
| 9040 |
C1Q |
Marking for UPC2745 part number, TO6 NEC package |
NEC |
| 9041 |
C1R |
Marking for UPC2746 part number, TO6 NEC package |
NEC |
| 9042 |
C1S |
Marking for UPC2747 part number, TO6 NEC package |
NEC |
| 9043 |
C1T |
Marking for UPC2748 part number, TO6 NEC package |
NEC |
| 9044 |
C2 PACKAGE |
44 Contact Hermetic Ceramic Chip Carrier |
TRW |
| 9045 |
C20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 9046 |
C20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 9047 |
C20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 9048 |
C2037 |
Marking for NE73432B part number, 32 NEC (TO-92) package |
NEC |
| 9049 |
C2258 |
Marking for NE080190-12 part number, 90 NEC package or NE080191-12 part number for 91 NEC package |
NEC |
| 9050 |
C2258 |
Marking for NE080190-12 part number, 90 NEC package or NE080191-12 part number for 91 NEC package |
NEC |
| 9051 |
C2259 |
Marking for NE080490-12 part number, 90 NEC package or NE080491-12 part number for 91 NEC package |
NEC |
| 9052 |
C2259 |
Marking for NE080490-12 part number, 90 NEC package or NE080491-12 part number for 91 NEC package |
NEC |
| 9053 |
C2570 |
Marking for NE02132 part number, 32 NEC (TO-92) package |
NEC |
| 9054 |
C2721 |
Marking for UPC2721 part number, G08 NEC package |
NEC |
| 9055 |
C2722 |
Marking for UPC2722 part number, G08 NEC package |
NEC |
| 9056 |
C2850 |
Marking for NE081090-12 part number, 90 NEC package or NE081091-12 part number for 91 NEC package |
NEC |
| 9057 |
C2850 |
Marking for NE081090-12 part number, 90 NEC package or NE081091-12 part number for 91 NEC package |
NEC |
| 9058 |
C3 PACKAGE |
28 Contact Hermetic Ceramic Chip Carrier |
TRW |
| 9059 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 9060 |
C30 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
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