No. |
Part Name |
Description |
Manufacturer |
91 |
CXD1250M |
Example of Combination of Frame Readout System CCD Image Sensor and System IC |
SONY |
92 |
CXD1254AR |
Example of Combination of Frame Readout System CCD Image Sensor and System IC |
SONY |
93 |
DS12885N |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
94 |
DS12885Q |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
95 |
DS12885QN |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
96 |
DS12885Q_T_R |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
97 |
DS12885S |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
98 |
DS12885T |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
99 |
DS12885TN |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
100 |
DS12885T_T_R |
Real-time clock, 14 bytes of clock and control registers, 114 bytes of general purpose RAM |
Dallas Semiconductor |
101 |
ECQV |
Designed for application where high density insertion of components is required. |
Panasonic |
102 |
ECQV1103JM |
Designed for application where high density insertion of components is required. |
Panasonic |
103 |
ECQV1104JM |
Designed for application where high density insertion of components is required. |
Panasonic |
104 |
ECQV1123JM |
Designed for application where high density insertion of components is required. |
Panasonic |
105 |
ECQV1124JM |
Designed for application where high density insertion of components is required. |
Panasonic |
106 |
ECQV1153JM |
Designed for application where high density insertion of components is required. |
Panasonic |
107 |
ECQV1154JM |
Designed for application where high density insertion of components is required. |
Panasonic |
108 |
ECQV1183JM |
Designed for application where high density insertion of components is required. |
Panasonic |
109 |
ECQV1184JM |
Designed for application where high density insertion of components is required. |
Panasonic |
110 |
ECQV1223JM |
Designed for application where high density insertion of components is required. |
Panasonic |
111 |
ECQV1224JM |
Designed for application where high density insertion of components is required. |
Panasonic |
112 |
ECQV1273JM |
Designed for application where high density insertion of components is required. |
Panasonic |
113 |
ECQV1274JM |
Designed for application where high density insertion of components is required. |
Panasonic |
114 |
ECQV1333JM |
Designed for application where high density insertion of components is required. |
Panasonic |
115 |
ECQV1334JM |
Designed for application where high density insertion of components is required. |
Panasonic |
116 |
ECQV1393JM |
Designed for application where high density insertion of components is required. |
Panasonic |
117 |
ECQV1394JM |
Designed for application where high density insertion of components is required. |
Panasonic |
118 |
ECQV1473JM |
Designed for application where high density insertion of components is required. |
Panasonic |
119 |
ECQV1474JM |
Designed for application where high density insertion of components is required. |
Panasonic |
120 |
ECQV1563JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| | | |