| No. |
Part Name |
Description |
Manufacturer |
| 91 |
C67076-A2106-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 92 |
C67076-A2107-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 93 |
C67076-A2108-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 94 |
C67076-A2109-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 95 |
CC1078 |
Plate-type ceramic capacitor with defined temperature coefficient |
IPRS Baneasa |
| 96 |
CGD12HBXMP |
Evaluation Gate Driver Tool Optimized for the XM3 Module Platform |
Wolfspeed |
| 97 |
CV104 |
Clock Generator for Desktop PC Platforms |
IDT |
| 98 |
CV105 |
Clock Generator for Desktop PC Platforms |
IDT |
| 99 |
CV107 |
Clock Generator for Desktop PC Platforms |
IDT |
| 100 |
CV109 |
Clock Generator for Desktop PC Platforms |
IDT |
| 101 |
CV119 |
Clock Generator for Desktop PC Platforms |
IDT |
| 102 |
CWR06 |
Solid Tantalum Chip Capacitors, Conformal, MIDGET® Solid-Electrolyte Military, MIL-C-55365/4 Qualified, Minimum Size, Tape and Reel Packaging, Gold Plate, 60/40 Electroplate, or Hot Solder Dipped Terminations Available |
Vishay |
| 103 |
CWR06 |
Solid Tantalum Chip Capacitors, Conformal, MIDGET® Solid-Electrolyte Military, MIL-C-55365/4 Qualified, Minimum Size, Tape and Reel Packaging, Gold Plate, 60/40 Electroplate, or Hot Solder Dipped Terminations Available |
Vishay |
| 104 |
CWR11 |
Solid Tantalum Chip Capacitors, TANTAMOUNT® Solid-Electrolyte, Military, MIL-C-55365/8 Qualified, Molded Case Available in Four Case Codes, Automatic Pick and Place Compatible, Solder Plate Terminations |
Vishay |
| 105 |
DA82562ET |
10/100 Mbps platform LAN connect (PLC) |
Intel |
| 106 |
DCEP |
Data Converter Evaluation Platform (DCEP), Evaluates High-Speed Data Converters (ADCs) |
MAXIM - Dallas Semiconductor |
| 107 |
DFP14 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 108 |
DFP16 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 109 |
EB4 |
Dual Readout, Standard and Right Angle Terminals, Selective Gold Plating, Polarization Between Contact Positions, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524, Project 77CH3889) |
Vishay |
| 110 |
EB6 |
Dual Readout, Standard and Right Angle Terminals, Selective Gold Plating, Polarization Between Contact Positions, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524, Project 77CH3889) |
Vishay |
| 111 |
EB7D |
Dual Readout, Selective Gold Plating, Polarization Between Contact Positions, Polarizing Key is Reinforced Nylon, Protected Entry |
Vishay |
| 112 |
EB7S |
Single Readout, Selective Gold Plating, Polarization Between Contact Positions, Polarizing Key is Reinforced Nylon, Protected Entry |
Vishay |
| 113 |
EB8 |
Dual Readout, Selective Gold Plating, Polarization Between Contact Positions, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524, Project 77CH3889) |
Vishay |
| 114 |
ECP-5414 |
AMD Geode�� GX1 Communication Platform |
etc |
| 115 |
ELANSC520 |
ElanSC520 Customer Development Platform User's Manual |
Advanced Micro Devices |
| 116 |
EP9315 |
Universal Platform System-on-Chip Processor |
Cirrus Logic |
| 117 |
EP9315 |
Universal Platform System-on-Chip Processor |
Cirrus Logic |
| 118 |
ERJM03NF10MV |
Current Sensing Chip Resistors, Metal Plate Type |
Panasonic |
| 119 |
ERJM03NJ10MV |
Current Sensing Chip Resistors, Metal Plate Type |
Panasonic |
| 120 |
ERJM03SF10MV |
Current Sensing Chip Resistors, Metal Plate Type |
Panasonic |
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