| No. |
Part Name |
Description |
Manufacturer |
| 91 |
74F50729 |
Synchronizing dual D-type flip-flop with edge-triggered set and reset with metastable immune characteristics |
Philips |
| 92 |
74HC |
HCMOS family characteristics |
Philips |
| 93 |
74HCT |
HCMOS family characteristics |
Philips |
| 94 |
74HCU |
HCMOS family characteristics |
Philips |
| 95 |
94SC |
General Use Capacitor with Superior High Frequency Characteristics Suitable for use in Noise Limiters and Switching Power Supplies |
Vishay |
| 96 |
AB-124 |
THD+N VERSUS FREQUENCY CHARACTERISTICS AND SPECTRA OF THE PCM1717 |
Burr Brown |
| 97 |
ACCESSORIES FOR TRANSISTORS |
Cooling Clips, Mounting Accessories, general explanatory notes, mechanical data, thermal characteristics |
Mullard |
| 98 |
ADAU1977 |
Quad ADC with Diagnostics (10V Input) |
Analog Devices |
| 99 |
AN-4242 |
A Review of Thyristor Characteristics and Applications - Application Note |
RCA Solid State |
| 100 |
AN-492 |
Operating characteristics of the MC3000/MC3100 series transistor-transistor logic gates - Application Note |
Motorola |
| 101 |
AN-6010 |
Characteristics and Broadband (225-to-400MHz) Applications of the RCA-2N6104 and 2N6105 UHF Power Transistors - App. Note |
RCA Solid State |
| 102 |
AN-90 |
74C Family Characteristics |
Fairchild Semiconductor |
| 103 |
AN-937 |
Gate Drive Characteristics and Requirements for HEXFET |
etc |
| 104 |
AN257 |
THERMAL CHARACTERISTICS OF THE MULTIWATT PACKAGE |
SGS Thomson Microelectronics |
| 105 |
AN258 |
THERMAL CHARACTERISTICS OF THE PENTAWATT/HEPTAWATT PACKAGES |
SGS Thomson Microelectronics |
| 106 |
AN264 |
RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF SMDS |
SGS Thomson Microelectronics |
| 107 |
AN35 |
The CS5504 Family Characteristics |
Cirrus Logic |
| 108 |
AN640 |
TEA5704-STV5712 DEMOBOARD USER'S INSTRUCTION AND CHARACTERISTICS |
SGS Thomson Microelectronics |
| 109 |
AN803 |
Thermal Characteristics of Siliconix's LITTLE FOOT Family of |
Vishay |
| 110 |
AN957 |
Measuring HEXFETCharacteristics |
etc |
| 111 |
AND8090 |
AC Characteristics of ECL Devices |
ON Semiconductor |
| 112 |
AND8090D |
AC Characteristics of ECL Devices |
ON Semiconductor |
| 113 |
APPLICATION-NOTE |
Zener Diode RD*JS, RD*E, RD*F Characteristics & Reliability |
NEC |
| 114 |
APPLICATION-NOTE |
Characteristics of 2GHz band mixer using-1SS97, 1SS98 and 1SS99 |
NEC |
| 115 |
AT75C310-Q160 |
Smart Internet Appliance Processor Electrical and Mechanical Characteristics |
Atmel |
| 116 |
BAX280 |
FRED Diode (VRRM 1000 V IFRMS 5.5 A 55 ns Soft recovery characteristics) |
Siemens |
| 117 |
BTS244Z |
Speed TEMPFET(N-Channel Enhancement mode Logic Level Input Potential-free temperature sensor with thyristor characteristics) |
Infineon |
| 118 |
BTS247Z |
Speed TEMPFET(N-Channel Enhancement mode Logic Level Input Potential-free temperature sensor with thyristor characteristics) |
Infineon |
| 119 |
BTS282Z |
Speed TEMPFET(N-Channel Enhancement mode Logic Level Input Potential-free temperature sensor with thyristor characteristics) |
Infineon |
| 120 |
BX DIELECTRIC |
Monolithic Ceramic Chip Capacitors, Designed for Excellent Temperature Voltage Coefficient, Excellent Aging Characteristics |
Vishay |
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