No. |
Part Name |
Description |
Manufacturer |
91 |
56274 |
Diecast Heatsink |
Philips |
92 |
56277 |
Diecast Heatsink |
Philips |
93 |
56278 |
Diecast Heatsink |
Philips |
94 |
56279 |
Diecast Heatsink |
Philips |
95 |
56280 |
Diecast Heatsink |
Philips |
96 |
56283 |
Diecast Heatsink |
Philips |
97 |
56284 |
Diecast Heatsink |
Philips |
98 |
56286 |
Diecast Heatsink |
Philips |
99 |
67025 |
4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY |
Micropac Industries |
100 |
67025-001 |
4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY |
Micropac Industries |
101 |
67025-003 |
4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY |
Micropac Industries |
102 |
67025-004 |
4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY |
Micropac Industries |
103 |
67025-101 |
4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY |
Micropac Industries |
104 |
A1 PACKAGE |
68 Contact Hermetic Ceramic Chip Carrier JEDEC Type A |
TRW |
105 |
BZ85C100RL |
1 watt hermetically sealed glass silicon zener diode |
Motorola |
106 |
C1 PACKAGE |
68 Contact Hermetic Ceramic Chip Carrier |
TRW |
107 |
C2 PACKAGE |
44 Contact Hermetic Ceramic Chip Carrier |
TRW |
108 |
C3 PACKAGE |
28 Contact Hermetic Ceramic Chip Carrier |
TRW |
109 |
E-L6452 |
Dual 13X16 Matrix InkJet Heads Drivers |
ST Microelectronics |
110 |
flat-heatsinks |
Thermal resistance of flat heatsinks |
Philips |
111 |
G0 PACKAGE |
68 Pin Grid Array, Cavity Down with Flat Heat Sink |
TRW |
112 |
H7826 |
Compact Head-on PMT |
Hamamatsu Corporation |
113 |
H7826-01 |
Compact Head-on PMT |
Hamamatsu Corporation |
114 |
H7826P |
Compact Head-on PMT |
Hamamatsu Corporation |
115 |
H7826P-01 |
Compact Head-on PMT |
Hamamatsu Corporation |
116 |
H7827 |
Compact Head-on PMT |
Hamamatsu Corporation |
117 |
H7827-001 |
Compact Head-on PMT |
Hamamatsu Corporation |
118 |
H7827-002 |
Compact Head-on PMT |
Hamamatsu Corporation |
119 |
H7827-011 |
Compact Head-on PMT |
Hamamatsu Corporation |
120 |
H7827-012 |
Compact Head-on PMT |
Hamamatsu Corporation |
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