| No. |
Part Name |
Description |
Manufacturer |
| 931 |
OUTLINE DIMENSIONS |
Toshiba outline dimensions and photos for diodes, rectifiers, silicon-controlled, rectifiers, silicon detectors, CdS photoconductive cells, thermistors |
TOSHIBA |
| 932 |
OUTLINE DIMENSIONS |
Toshiba outline dimensions and photos for diodes, rectifiers, silicon-controlled, rectifiers, silicon detectors, CdS photoconductive cells, thermistors, DO-7, DO-1, |
TOSHIBA |
| 933 |
OUTLINE DIMENSIONS |
Toshiba outline dimensions and photos for diodes, rectifiers, silicon-controlled, rectifiers, silicon detectors, CdS photoconductive cells, thermistors, DO-7, DO-1, |
TOSHIBA |
| 934 |
OUTLINES |
Cases, shape and dimensions |
IPRS Baneasa |
| 935 |
P-3-CASE |
Shape and dimensions Case |
CCSIT-CE |
| 936 |
P08 |
Package 8-Pin Molded DIP - physical dimensions |
Micro Linear |
| 937 |
P14 |
Package 14-Pin Molded DIP - physical dimensions |
Micro Linear |
| 938 |
P16 |
Package 16-Pin Molded DIP - physical dimensions |
Micro Linear |
| 939 |
P18 |
Package 18-Pin Molded DIP - physical dimensions |
Micro Linear |
| 940 |
P2-CASE |
Shape and dimensions Case |
CCSIT-CE |
| 941 |
P20 |
Package 20-Pin Molded DIP - physical dimensions |
Micro Linear |
| 942 |
P22 |
Package 22-Pin Molded DIP - physical dimensions |
Micro Linear |
| 943 |
P24N |
Package 24-Pin Molded DIP (Narrow) - physical dimensions |
Micro Linear |
| 944 |
P24W |
Package 24-Pin Molded DIP (Wide) - physical dimensions |
Micro Linear |
| 945 |
P28N |
Package 28-Pin Molded DIP (Narrow) - physical dimensions |
Micro Linear |
| 946 |
P28W |
Package 28-Pin Molded DIP - physical dimensions |
Micro Linear |
| 947 |
P3-1A1600 |
Outside Dimension:Unit P3-1A1600 |
Cosmo Electronics |
| 948 |
P3-1A1700 |
Outside Dimension:Unit |
Cosmo Electronics |
| 949 |
P4-CASE |
Shape and dimensions Case |
CCSIT-CE |
| 950 |
P40 |
Package 40-Pin Molded Plastic DIP - physical dimensions |
Micro Linear |
| 951 |
PA-46-U |
Shape and dimensions CEI package |
SESCOSEM |
| 952 |
PACKAGE DIMENSION |
28TSOP2-300 Package Dimension |
Samsung Electronic |
| 953 |
PACKAGE DIMENSION |
28TSOP2-300 Package Dimension |
Samsung Electronic |
| 954 |
PACKAGE DIMENSIONS |
Plastic and Ceramic IC Packages from Samsung High Performance CMOS Logic Data Book 1988 |
Samsung Electronic |
| 955 |
PACKAGE INFORMATION |
Packages dimensions and shape from Siliconix Analog Integrated Circuits Data Book 1994 |
Siliconix |
| 956 |
PACKAGE OUTLINES |
Package Outlines, Shape and dimensions |
Intersil |
| 957 |
PACKAGES |
Physical Dimensions |
National Semiconductor |
| 958 |
PAM |
Case dimensions |
Motorola |
| 959 |
PC-1602H |
OUTLINE DIMENSION & BLOCK DIAGRAM |
Powertip Technology |
| 960 |
PC0802 |
OUTLINE DIMENSION & BLOCK DIAGRAM |
Powertip Technology |
| | | |
