| No. |
Part Name |
Description |
Manufacturer |
| 9691 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 9692 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 9693 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 9694 |
D123AL |
SPST 6-Channel JFET Switch Driver, Military 14-pin Flat Package |
Intersil |
| 9695 |
D123BL |
SPST 6-Channel JFET Switch Driver, Industrial 14-pin Flat Package |
Intersil |
| 9696 |
D125AL |
SPST 6-Channel JFET Switch Driver, Military 14-pin Flat Package |
Intersil |
| 9697 |
D125BL |
SPST 6-Channel JFET Switch Driver, Industrial 14-pin Flat Package |
Intersil |
| 9698 |
D14A |
14-Lead Ceramic Package |
Analog Devices |
| 9699 |
D14B |
14-Lead Ceramic DIP Package |
Analog Devices |
| 9700 |
D14D |
14 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 9701 |
D14E |
14-Lead Hermetic Dual-In-Line Package |
National Semiconductor |
| 9702 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 9703 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 9704 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 9705 |
D16A |
16-Pin Ceramic DIP Package |
Analog Devices |
| 9706 |
D16B |
16-Pin Ceramic DIP Package |
Analog Devices |
| 9707 |
D16C |
16 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 9708 |
D16D |
16-Lead Hybrid Metal Can Dual-In-Line Package |
National Semiconductor |
| 9709 |
D18A |
18-Pin Ceramic DIP Package |
Analog Devices |
| 9710 |
D18A |
18 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 9711 |
D18B |
18-Pin Ceramic DIP Package |
Analog Devices |
| 9712 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 9713 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 9714 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 9715 |
D20A |
20-Pin Ceramic DIP Package |
Analog Devices |
| 9716 |
D20A |
20 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 9717 |
D20B |
20-Pin Ceramic DIP Package |
Analog Devices |
| 9718 |
D20B |
20 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
| 9719 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 9720 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
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