| No. |
Part Name |
Description |
Manufacturer |
| 1 |
10 LEAD FLATPACK (FB) |
Package Outlines |
Intersil |
| 2 |
ADSP-CM402F |
ARM Cortex M4 Mixed-Signal Control Processor with Precision 16 bit ADCs in 14x14mm 120 lead LQFP |
Analog Devices |
| 3 |
ADSP-CM403F |
ARM Cortex M4 Mixed-Signal Control Processor with High Precision 16 bit ADCs in 14x14mm 120 lead LQFP |
Analog Devices |
| 4 |
BD6142AMUV |
8-Channel White LED Driver with Integrated FET for up to 80 LEDs |
ROHM |
| 5 |
BD6142AMUV-E2 |
8-Channel White LED Driver with Integrated FET for up to 80 LEDs |
ROHM |
| 6 |
BD65D00MUV |
4-Channel White LED Driver with Integrated FET for up to 40 LEDs |
ROHM |
| 7 |
BD65D00MUV-E2 |
4-Channel White LED Driver with Integrated FET for up to 40 LEDs |
ROHM |
| 8 |
BD8119FM-M |
4-Channel Buck-Boost White LED Driver for up to 40 LEDs |
ROHM |
| 9 |
BD8119FM-ME2 |
4-Channel Buck-Boost White LED Driver for up to 40 LEDs |
ROHM |
| 10 |
BD81A24EFV-M |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 11 |
BD81A24EFV-ME2 |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 12 |
BD81A24MUV-M |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 13 |
BD81A24MUV-ME2 |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 14 |
BD81A44EFV-M |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 15 |
BD81A44EFV-ME2 |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 16 |
BD81A44MUV-M |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 17 |
BD81A44MUV-ME2 |
4ch White LED Driver with Buck-Boost (40 LED Maximum) |
ROHM |
| 18 |
CAT4238 |
LED Driver, Boost, 10 LED, series |
ON Semiconductor |
| 19 |
CERPACK |
10 Lead Cerpack NS Package Number W10A |
National Semiconductor |
| 20 |
CM10 |
10 LEAD TO-5 package |
PLESSEY Semiconductors |
| 21 |
CM10/S |
10 LEAD TO-100 (5.84mm PCD) With STANDOFF |
PLESSEY Semiconductors |
| 22 |
D20A |
20 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 23 |
D20B |
20 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
| 24 |
D40C |
40 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 25 |
DC40 |
40 LEAD (SIDE BRAZED) DIL PACKAGE |
PLESSEY Semiconductors |
| 26 |
DG20 |
20 LEAD CERAMIC DIL PACKAGE |
PLESSEY Semiconductors |
| 27 |
DG40 |
40 LEAD CERAMIC DIL package |
PLESSEY Semiconductors |
| 28 |
DIPR |
DIP R - 40 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 29 |
DIPZ |
DIP Z - 40 lead plastic DIP - Outline drawings |
SGS-ATES |
| 30 |
DP40 |
40 LEAD PLASTIC DIL PACKAGE |
PLESSEY Semiconductors |
| | | |
