| No. |
Part Name |
Description |
Manufacturer |
| 31 |
IR1175SS |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SOIC package |
International Rectifier |
| 32 |
IR1175STR |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 33 |
IR1176 |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead DIP package |
International Rectifier |
| 34 |
IR1176S |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 35 |
IR1176SS |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SOIC package |
International Rectifier |
| 36 |
IR1176STR |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 37 |
IR2167 |
PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead DIP package |
International Rectifier |
| 38 |
IR2167S |
PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead SOIC package |
International Rectifier |
| 39 |
IR3220 |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
| 40 |
IR3220S |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
| 41 |
IR3220STR |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
| 42 |
J20A |
20 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 43 |
J20AQ |
J20AQ 20 Lead Ceramic Dual-In-Line Package, EPROM |
National Semiconductor |
| 44 |
J40A |
40 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 45 |
J40AQ |
40 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 46 |
J40BQ |
40 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 47 |
M20B |
20 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 48 |
M20D |
20 Lead (0.300 in. Wide) Molded Small Outline Package, EIAJ |
National Semiconductor |
| 49 |
M40A |
40 Lead (0.300 in. Wide) Molded Very Small Outline Package |
National Semiconductor |
| 50 |
MC20A |
20 Lead Ceramic Small Outline Package |
National Semiconductor |
| 51 |
MC20B |
20 Lead Ceramic Small Outline Package, EPROM |
National Semiconductor |
| 52 |
MKT-V20A |
PLASTIC CHIP CARRIER SQ 050 LD PITCH 20 LEAD |
National Semiconductor |
| 53 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 54 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
| 55 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 56 |
MTA20 |
20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I |
National Semiconductor |
| 57 |
MTC20 |
20 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 58 |
N20A |
20 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 59 |
N20B |
20 Lead 0.300 Inch Wide Molded Dual-In-Line Package |
National Semiconductor |
| 60 |
N40A |
40 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
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