No. |
Part Name |
Description |
Manufacturer |
31 |
E20A |
20 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
32 |
E40A |
40 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
33 |
EA20B |
20 Lead Ceramic Leadless Chip Carrier |
National Semiconductor |
34 |
EL100A |
100 Lead Ceramic Quad Flatpack |
National Semiconductor |
35 |
F10B |
10 Lead Ceramic Flatpack |
National Semiconductor |
36 |
H10C |
10 Lead (0.230 in. Diameter P.C.) TO-5 Metal Can Package |
National Semiconductor |
37 |
IR1175 |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead DIP package |
International Rectifier |
38 |
IR1175S |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
39 |
IR1175SS |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SOIC package |
International Rectifier |
40 |
IR1175STR |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
41 |
IR1176 |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead DIP package |
International Rectifier |
42 |
IR1176S |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
43 |
IR1176SS |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SOIC package |
International Rectifier |
44 |
IR1176STR |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
45 |
IR2167 |
PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead DIP package |
International Rectifier |
46 |
IR2167S |
PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead SOIC package |
International Rectifier |
47 |
IR3220 |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
48 |
IR3220S |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
49 |
IR3220STR |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
50 |
J20A |
20 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
51 |
J20AQ |
J20AQ 20 Lead Ceramic Dual-In-Line Package, EPROM |
National Semiconductor |
52 |
J40A |
40 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
53 |
J40AQ |
40 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
54 |
J40BQ |
40 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
55 |
M20B |
20 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
56 |
M20D |
20 Lead (0.300 in. Wide) Molded Small Outline Package, EIAJ |
National Semiconductor |
57 |
M40A |
40 Lead (0.300 in. Wide) Molded Very Small Outline Package |
National Semiconductor |
58 |
MC20A |
20 Lead Ceramic Small Outline Package |
National Semiconductor |
59 |
MC20B |
20 Lead Ceramic Small Outline Package, EPROM |
National Semiconductor |
60 |
MKT-V20A |
PLASTIC CHIP CARRIER SQ 050 LD PITCH 20 LEAD |
National Semiconductor |
| | | |