| No. |
Part Name |
Description |
Manufacturer |
| 1 |
14 LEAD CERAMIC(DD) |
PACKAGE OUTLINES |
Intersil |
| 2 |
14 LEAD CERDIP(JD) |
PACKAGE OUTLINES |
Intersil |
| 3 |
14 LEAD FLATPACK(FD-1) |
PACKAGE OUTLINES |
Intersil |
| 4 |
14 LEAD FLATPACK(FD-2) |
PACKAGE OUTLINES |
Intersil |
| 5 |
14 LEAD PLASTIC(PD) |
PACKAGE OUTLINES |
Intersil |
| 6 |
AD5678 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 7 |
AD5678WRUZ-2 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 8 |
AD5678WRUZ-2REEL7 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 9 |
AD5678YRUZ-1 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 10 |
AD5678YRUZ-1REEL7 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 11 |
AD5678YRUZ-2 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 12 |
AD5678YRUZ-2REEL7 |
4 x12-Bit and 4 x16-Bit Octal D/A Converter with On-Chip Reference in 14 Lead TSSOP |
Analog Devices |
| 13 |
CLI700 |
Reflective switch, photo-IC output, 4 Lead TO-72 metal can |
Clairex Technologies |
| 14 |
CLI710 |
Reflective switch, phototransistor output, 4 Lead TO-72 metal can |
Clairex Technologies |
| 15 |
D14D |
14 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 16 |
D24C |
24 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 17 |
D24H |
24 Lead (0.300 in. Wide) Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 18 |
D24K |
24 Lead (0.400 in. Wide) Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 19 |
DC14 |
14 LEAD DILMON PACKAGE |
PLESSEY Semiconductors |
| 20 |
DG14 |
14 LEAD CERAMIC DIL PACKAGE |
PLESSEY Semiconductors |
| 21 |
DG14 |
14 LEAD CERAMIC DIL |
PLESSEY Semiconductors |
| 22 |
DG14 |
14 LEAD CERAMIC DIL Package Outlines |
PLESSEY Semiconductors |
| 23 |
DG24 |
24 LEAD CERAMIC DIL package |
PLESSEY Semiconductors |
| 24 |
DG24 |
24 LEAD CERAMIC DIL PACKAGE |
PLESSEY Semiconductors |
| 25 |
DIPA |
DIP A - 14 lead plastic split DIP with copper insert - Outline drawings |
SGS-ATES |
| 26 |
DIPB |
DIP B - 14 lead plastic split DIP with external bar - Outline drawings |
SGS-ATES |
| 27 |
DIPC |
DIP C - 14 lead plastic split DIP with inverted external bar - Outline drawings |
SGS-ATES |
| 28 |
DIPD |
DIP D - 14 lead plastic DIP with spacer - Outline drawings |
SGS-ATES |
| 29 |
DIPE |
DIP E - 14 lead plastic split DIP - Outline drawings |
SGS-ATES |
| 30 |
DIPH |
DIP H - 14 lead plastic DIP - Outline drawings |
SGS-ATES |
| | | |
