| No. |
Part Name |
Description |
Manufacturer |
| 61 |
IR2114 |
600V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 62 |
IR21141 |
600V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 63 |
IR21141SSTRPBF |
600V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 64 |
IR2114SSTRPBF |
600V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 65 |
IR21381 |
600V, 3 Phase IGBT Driver best suited for AC motor drive applications packaged in a 64 lead MQFP |
International Rectifier |
| 66 |
IR21381QPBF |
600V, 3 Phase IGBT Driver best suited for AC motor drive applications packaged in a 64 lead MQFP |
International Rectifier |
| 67 |
IR2214 |
Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 68 |
IR22141SS |
Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package. |
International Rectifier |
| 69 |
IR22141SSTRPBF |
1200V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 70 |
IR2214SS |
Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 71 |
IR2214SSTRPBF |
1200V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package |
International Rectifier |
| 72 |
IR22381 |
1200V, 3 Phase IGBT Driver best suited for AC motor drive applications packaged in a 64 lead MQFP |
International Rectifier |
| 73 |
J14A |
14 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 74 |
J24A |
24 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 75 |
J24AQ |
24 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 76 |
J24BQ |
24 Lead Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 77 |
J24CQ |
24 Lead (0.300 in. Wide) Ceramic Dual-in-Line Package, EPROM |
National Semiconductor |
| 78 |
J24E |
24 Lead (0.400 in. Wide) Ceramic Dual-in-Line Package |
National Semiconductor |
| 79 |
J24F |
24 Lead (0.300 Centers) Ceramic Dual-In-Line Package |
National Semiconductor |
| 80 |
K04A |
4 Lead TO-3 Metal Can Package |
National Semiconductor |
| 81 |
KA04B |
4 Lead TO-3 Metal Can Package, Low Profile |
National Semiconductor |
| 82 |
M14A |
14 Lead (0.150 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 83 |
M14B |
14 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 84 |
M14D |
14 Lead (0.300 in. Wide) Molded Small Outline Package, EIAJ |
National Semiconductor |
| 85 |
M24B |
24 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 86 |
MC24A |
24 Lead Ceramic Small Outline Package |
National Semiconductor |
| 87 |
MCP6544 |
The MCP6544 is a Push-pull, quad comparator. This single-ended device operates from 1.6V to 5.5V, with typical quiescent current of 600 nA and a maximum of 1 microamp. This device is offered in the 16 lead PDIP, SOIC and 14 lead TSSOP pack |
Microchip |
| 88 |
MKT-D14D |
DIP, SIDEBRAZED CERAMIC 14 LEAD |
National Semiconductor |
| 89 |
MKT-H04D |
4 LEAD.100 DIA P.C.SHIELDED METAL CAN PACKAGE (H) |
National Semiconductor |
| 90 |
MKT-J24A |
CERDIP 24 LEAD 600 CENTERS |
National Semiconductor |
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