| No. |
Part Name |
Description |
Manufacturer |
| 1 |
1300-102-4XX |
2.54mm IDC Connector |
Methode Electronics Incorporated |
| 2 |
335824B00034 |
TAPE Attachment Method |
etc |
| 3 |
970 |
Micro Mate Surface Mount Dual Row Receptacle |
Methode Electronics Incorporated |
| 4 |
A290D |
Stereo decoder, PLL method, possibly equivalent MC1310P |
RFT |
| 5 |
AN1116 |
CHANGING FROM THE ST95P08 TO THE M95080 IN YOUR APPLICATION USING A SIMPLE SOFTWARE RECOGNITION METHOD |
SGS Thomson Microelectronics |
| 6 |
AN1221 |
A SIMPLE METHOD TO DRIVE A TRIAC WITH ST52X420 DIRECTLY FROM THE MAIN |
SGS Thomson Microelectronics |
| 7 |
AN1262 |
OFFLINE FLYBACK CONVERTERS DESIGN METHODOLOGY WITH THE L6590 FAMILY |
SGS Thomson Microelectronics |
| 8 |
AN1436 |
CHANGING FROM THE ST95010/ST95020 TO THE M95010/M95020 IN YOUR APPLICATION USING A SIMPLE RECOGNITION METHOD |
SGS Thomson Microelectronics |
| 9 |
AN577 |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE |
SGS Thomson Microelectronics |
| 10 |
AN8801SC |
Three-Beam Method Head Amplifier IC for CD Player |
Panasonic |
| 11 |
AN8805SB |
Three-Beam Method Head Amplifier IC for CD (supporting the hologram pick-up) |
Panasonic |
| 12 |
AN8807 |
Three-Beam Method Head Amplifier IC for CD-ROM |
Panasonic |
| 13 |
AN8807SB |
Three-Beam Method Head Amplifier IC for CD-ROM |
Panasonic |
| 14 |
AN8808SB |
Three-Beam Method Head Amplifier IC for CD supporting the hologram pick-up |
Panasonic |
| 15 |
APPLICATION-NOTE |
Optimum method of use of low frequency low noise transistors |
NEC |
| 16 |
CA3338 |
D/A Converter, Video, CMOS, 8-Bit, R2R Method, 50MSPS, 1LSB |
Intersil |
| 17 |
CA3338A |
D/A Converter, Video, CMOS, 8-Bit, R2R Method, 50MSPS, 0.75LSB |
Intersil |
| 18 |
DFM14 |
Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 19 |
DFP14 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 20 |
DFP16 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 21 |
DS26F32ME/883 |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 22 |
DS26F32MER-QML |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 23 |
DS26F32MJ-QMLV |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 24 |
DS26F32MJR-QML |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 25 |
DS26F32MJRQMLV |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 26 |
DS26F32MW-QMLV |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 27 |
DS26F32MWG/883 |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 28 |
DS26F32MWGRQMLV |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 29 |
DS26F32MWR-QML |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| 30 |
DS26F32MWRQMLV |
QUAD DIFFERENTIAL LINE RECEIVERS ALSO AVAILABLE GUARANTEED TO 100K RAD(Si) TESTED TO MIL-STD-883, METHOD 1019.5, CONDITION A |
National Semiconductor |
| | | |
