| No. |
Part Name |
Description |
Manufacturer |
| 1021 |
MAX6411BS44 |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1022 |
MAX6411BS44-T |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1023 |
MAX6411BS45+ |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1024 |
MAX6411BS45+T |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1025 |
MAX6411BS45-T |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1026 |
MAX6411BS46 |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1027 |
MAX6411BS46-T |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 1028 |
MBH32A |
32 Lead Molded Thin Small Outline Package, EIAJ, Type I |
National Semiconductor |
| 1029 |
MBS28A |
28-Lead Thin Small Outline Package, Type I |
National Semiconductor |
| 1030 |
MC16A |
16 Lead Ceramic Small Outline Package |
National Semiconductor |
| 1031 |
MC20A |
20 Lead Ceramic Small Outline Package |
National Semiconductor |
| 1032 |
MC20B |
20 Lead Ceramic Small Outline Package, EPROM |
National Semiconductor |
| 1033 |
MC24A |
24 Lead Ceramic Small Outline Package |
National Semiconductor |
| 1034 |
MC28A |
28 Lead Ceramic Small Outline Package |
National Semiconductor |
| 1035 |
MC28B |
28 Lead Ceramic Small Outline Package, EPROM |
National Semiconductor |
| 1036 |
MDM14 |
Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics |
Vishay |
| 1037 |
MDM16 |
Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics |
Vishay |
| 1038 |
MDP14 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
| 1039 |
MDP14 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
| 1040 |
MDP16 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
| 1041 |
MDP16 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
| 1042 |
MDP16-45 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
| 1043 |
MDP16-45 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
| 1044 |
MDP16-46 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
| 1045 |
MDP16-46 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
| 1046 |
MDRC |
Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs |
Vishay |
| 1047 |
MPXV4115V |
Integrated Pressure Sensor - Small Outline Package |
Freescale (Motorola) |
| 1048 |
MPXV6115V |
High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package |
Freescale (Motorola) |
| 1049 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1050 |
MQA24 |
24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
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