| No. |
Part Name |
Description |
Manufacturer |
| 1051 |
MR990A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1052 |
MR991A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1053 |
MR992A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1054 |
MR993A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1055 |
MR994A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1056 |
MR995A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1057 |
MR996A |
High-Voltage, low-current rectifiers designed where high-voltages in subminiature packages are required |
Motorola |
| 1058 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
| 1059 |
MS48A |
48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1060 |
MS56A |
56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1061 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 1062 |
MSA24 |
24 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 1063 |
MSA28 |
28-Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| 1064 |
MSP |
Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible |
Vishay |
| 1065 |
MTA20 |
20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I |
National Semiconductor |
| 1066 |
MTB24 |
24-Lead Molded Thin Shrink Small Outline Package |
National Semiconductor |
| 1067 |
MTC08 |
8-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1068 |
MTC14 |
14 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1069 |
MTC16 |
20-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1070 |
MTC20 |
20 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1071 |
MTC24 |
24 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1072 |
MTD48 |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1073 |
MTD56 |
56 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 1074 |
N08E |
8 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 1075 |
N10A |
10-Lead Molded Dual-In-Line Package |
National Semiconductor |
| 1076 |
N14A |
14 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 1077 |
N16A |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 1078 |
N16E |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 1079 |
N16G |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package, Thermally Enhanced |
National Semiconductor |
| 1080 |
N18A |
18 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
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