No. |
Part Name |
Description |
Manufacturer |
121 |
MDM14 |
Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics |
Vishay |
122 |
MDM16 |
Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics |
Vishay |
123 |
MDP14 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
124 |
MDP16 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
125 |
MDP16-45 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
126 |
MDP16-46 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
127 |
MDRC |
Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs |
Vishay |
128 |
MPXV4115V |
Integrated Pressure Sensor - Small Outline Package |
Freescale (Motorola) |
129 |
MPXV6115V |
High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package |
Freescale (Motorola) |
130 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
131 |
MQA24 |
24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
132 |
MS40A |
40 Lead Molded Shrink Small Outline Package, EIAJ, Type III |
National Semiconductor |
133 |
MS48A |
48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
134 |
MS56A |
56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
135 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
136 |
MSA24 |
24 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
137 |
MSA28 |
28-Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
138 |
MSP |
Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible |
Vishay |
139 |
MTA20 |
20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I |
National Semiconductor |
140 |
MTB24 |
24-Lead Molded Thin Shrink Small Outline Package |
National Semiconductor |
141 |
MTC08 |
8-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
142 |
MTC14 |
14 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
143 |
MTC16 |
20-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
144 |
MTC20 |
20 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
145 |
MTC24 |
24 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
146 |
MTD48 |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
147 |
MTD56 |
56 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
148 |
N08E |
8 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
149 |
N10A |
10-Lead Molded Dual-In-Line Package |
National Semiconductor |
150 |
N14A |
14 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
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