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Datasheets for INE PA

Datasheets found :: 183
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No. Part Name Description Manufacturer
121 MDM14 Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics Vishay
122 MDM16 Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics Vishay
123 MDP14 Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack Vishay
124 MDP16 Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack Vishay
125 MDP16-45 Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Vishay
126 MDP16-46 Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Vishay
127 MDRC Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs Vishay
128 MPXV4115V Integrated Pressure Sensor - Small Outline Package Freescale (Motorola)
129 MPXV6115V High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package Freescale (Motorola)
130 MQA20 20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
131 MQA24 24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
132 MS40A 40 Lead Molded Shrink Small Outline Package, EIAJ, Type III National Semiconductor
133 MS48A 48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
134 MS56A 56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC National Semiconductor
135 MSA20 20 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
136 MSA24 24 Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
137 MSA28 28-Lead Molded Shrink Small Outline Package, EIAJ, Type II National Semiconductor
138 MSP Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible Vishay
139 MTA20 20 Lead Molded Thin Shrink Small Outline Package, EIAJ, Type I National Semiconductor
140 MTB24 24-Lead Molded Thin Shrink Small Outline Package National Semiconductor
141 MTC08 8-Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
142 MTC14 14 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
143 MTC16 20-Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
144 MTC20 20 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
145 MTC24 24 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
146 MTD48 48 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
147 MTD56 56 Lead Molded Thin Shrink Small Outline Package, JEDEC National Semiconductor
148 N08E 8 Lead (0.300 in. Wide) Molded Dual-in-Line Package National Semiconductor
149 N10A 10-Lead Molded Dual-In-Line Package National Semiconductor
150 N14A 14 Lead (0.300 in. Wide) Molded Dual-in-Line Package National Semiconductor


Datasheets found :: 183
Page: | 1 | 2 | 3 | 4 | 5 | 6 | 7 |



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