| No. |
Part Name |
Description |
Manufacturer |
| 151 |
N16A |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 152 |
N16E |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 153 |
N16G |
16 Lead (0.300 in. Wide) Molded Dual-in-Line Package, Thermally Enhanced |
National Semiconductor |
| 154 |
N18A |
18 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 155 |
N20A |
20 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 156 |
N20B |
20 Lead 0.300 Inch Wide Molded Dual-In-Line Package |
National Semiconductor |
| 157 |
N22A |
22 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 158 |
N22B |
22 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 159 |
N24A |
24 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 160 |
N24C |
24 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 161 |
N24D |
24 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 162 |
N24E |
24 Lead (0.400 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 163 |
N28B |
28 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 164 |
N40A |
40 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 165 |
N48A |
48 Lead (0.600 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| 166 |
NA24F |
24-Lead Molded Dual-Inline Package, IPS1 |
National Semiconductor |
| 167 |
NA24G |
24-Lead Molded Dual-In-Line Package |
National Semiconductor |
| 168 |
NA28F |
28-Lead Molded Dual Inline Package(s) |
National Semiconductor |
| 169 |
PS21204 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE |
Mitsubishi Electric Corporation |
| 170 |
PS21205 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE |
Mitsubishi Electric Corporation |
| 171 |
PS21212 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE |
Mitsubishi Electric Corporation |
| 172 |
PS21312 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE |
Mitsubishi Electric Corporation |
| 173 |
PS21313 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE |
Mitsubishi Electric Corporation |
| 174 |
Q62702-X143 |
Silicon PIN Diode (Fast switching In stripline package other lead configurations available) |
Siemens |
| 175 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 176 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 177 |
SOMC |
Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, |
Vishay |
| 178 |
TCM850 |
The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range |
Microchip |
| 179 |
TCM851 |
The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range |
Microchip |
| 180 |
TCM852 |
The TCM850/1/2/3 combines an inverting charge pump and a low noise linear regulator in a single small outline package. They are ideal for biasing GaAS FETs in cellular telephone transmitter power amplifiers All four devices accept a range |
Microchip |
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