| No. |
Part Name |
Description |
Manufacturer |
| 151 |
K4S561632E-UC60 |
256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) |
Samsung Electronic |
| 152 |
K4S561632E-UC75 |
256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) |
Samsung Electronic |
| 153 |
K4S561632E-UL60 |
256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) |
Samsung Electronic |
| 154 |
K4S561632E-UL75 |
256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) |
Samsung Electronic |
| 155 |
KSD1692 |
NPN (HIGH DC CURRENT GAIN LOW COLLECTOR SATURATION VOLTAGE BUILT-IN A DAMPER DIODE AT E-C) |
Samsung Electronic |
| 156 |
LSM303C |
Ultra-compact high-performance e-compass 3D accelerometer and 3D magnetometer module |
ST Microelectronics |
| 157 |
LSM303CTR |
Ultra-compact high-performance e-compass 3D accelerometer and 3D magnetometer module |
ST Microelectronics |
| 158 |
LSM303D |
Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module |
ST Microelectronics |
| 159 |
LSM303DLHC |
Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module |
ST Microelectronics |
| 160 |
LSM303DLHCTR |
Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module |
ST Microelectronics |
| 161 |
LSM303DTR |
Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module |
ST Microelectronics |
| 162 |
LX8204 |
Smart E-Fuse Devices |
Microsemi |
| 163 |
LX8233 |
Smart E-Fuse Devices |
Microsemi |
| 164 |
LX8237 |
Smart E-Fuse Devices |
Microsemi |
| 165 |
M368L3223ETM-CC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 166 |
M368L3223ETM-LC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 167 |
M368L6423ETM-CC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 168 |
M368L6423ETM-LC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 169 |
M381L3223ETM-LC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 170 |
M381L6423ETM-CC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 171 |
M381L6423ETM-LC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
Samsung Electronic |
| 172 |
M390S2858ET1-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 173 |
M390S2858ETU |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 174 |
M390S2858ETU-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 175 |
M390S3253ET1-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 176 |
M390S3253ETU-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 177 |
M390S6450ET1-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 178 |
M390S6450ETU-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 179 |
M390S6453ET1-C7A |
168pin Registered Module based on 256Mb E-die with 72-bit ECC |
Samsung Electronic |
| 180 |
MAX17135 |
Multi-Output DC-DC Power Supply with VCOM Amplifier and Temperature Sensor for E-Paper Applications |
MAXIM - Dallas Semiconductor |
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