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Datasheets for CONSI

Datasheets found :: 2470
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No. Part Name Description Manufacturer
31 BAV40 Multiple Diode, diode array consisting of 8 silicon planar epitaxial diodes Philips
32 BCR400 Application Considerations for the Integrated Bias Control Circuits Infineon
33 CA3019 Diode array, consists of one diode Quad and two isolated diodes on a common substrate RCA Solid State
34 CQY13 Solid-state photo-relays consisting of a GaAs electroluminiscent diode and a silicon n-p-n photo-transistor Mullard
35 CQY23 Solid-state photo-relays consisting of a GaAs electroluminiscent diode and a silicon n-p-n photo-transistor Mullard
36 DESIGN CONSIDERATIONS Selecting TTL Logic, Noise Immunity, Electrical Characteristics, power consumption, absolute maximum ratings Motorola
37 DME150 150 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
38 DME150-2 150 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
39 DME150-3 150 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
40 DME500 500 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
41 DME500-2 500 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
42 DME500-3 500 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
43 DMEG250 250 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
44 DMEG250-2 250 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
45 DMEG250-3 250 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip Acrian
46 EB107 Application Note - Mounting considerations for Motorola RF power modules Motorola
47 FJH261/7442N BCD-to-decimal decoder consisting of eight inverters and ten 4-input NAND gates Mullard
48 FJJ151/7491AN 8-bit shift register consisting of eight R-S master-slave flip-flops with input gating and clock driver Mullard
49 FJJ271 8-bit shift register consisting of eight R-S master-slave flip-flops with input gating and clock driver Mullard
50 H24B1 THE H24B SERIES CONSISTS OF A GALLIUM ARSENIDE INFRARED EMITTING DIODE COUPLED WITH A SILICON PHOTOTRANSISTOR QT Optoelectronics
51 H24B2 THE H24B SERIES CONSISTS OF A GALLIUM ARSENIDE INFRARED EMITTING DIODE COUPLED WITH A SILICON PHOTOTRANSISTOR QT Optoelectronics
52 IRIS-G6651 IRIS-G6651 is a hybrid IC consists from power MOSFET and a controller IC International Rectifier
53 K-Series Application Information - Direct Access Arrangement (DAA), Design and Layout Considerations Silicon Systems
54 K101 Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) Kodenshi Corp
55 K101 Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) Kondenshi Corp
56 K102 Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) Kodenshi Corp
57 K102 Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) Kondenshi Corp
58 K104 Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) Kodenshi Corp
59 K104 Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) Kondenshi Corp
60 K201 Photocoupler(These Photocouplers consist of two Gallium Arsenide Infrared Emitting) Kodenshi Corp


Datasheets found :: 2470
Page: | 1 | 2 | 3 | 4 | 5 | 6 |



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