| No. |
Part Name |
Description |
Manufacturer |
| 3751 |
DG-20 |
DG20 CERDIP Packaging Information |
Hitachi Semiconductor |
| 3752 |
DG-211V |
Photointerrupters(Transmissive) |
Kodenshi Corp |
| 3753 |
DG-211V |
Photointerrupters(Transmissive) |
Kondenshi Corp |
| 3754 |
DG-24 |
DG24 CERDIP Packaging Information |
Hitachi Semiconductor |
| 3755 |
DG-24A |
DG24A CERDIP Packaging Information |
Hitachi Semiconductor |
| 3756 |
DG-24B |
DG24B CERDIP Packaging Information |
Hitachi Semiconductor |
| 3757 |
DG-28 |
DG28 Packaging Information |
Hitachi Semiconductor |
| 3758 |
DG-290 |
Photointerrupters(Transmissive) |
Kodenshi Corp |
| 3759 |
DG-290 |
Photointerrupters(Transmissive) |
Kondenshi Corp |
| 3760 |
DN1811 |
LSI for 16 CH Multiplexing |
Mitsubishi Electric Corporation |
| 3761 |
DP-14 |
Hex Schmitt-trigger Inverters |
Hitachi Semiconductor |
| 3762 |
DP-16 |
DUAL-IN-LINE Plastic DP16 Packaging information |
Hitachi Semiconductor |
| 3763 |
DP-18 |
DUAL-IN-LINE Plastic DP18 Packaging information |
Hitachi Semiconductor |
| 3764 |
DP-20 |
DUAL-IN-LINE Plastic DP20 Packaging information |
Hitachi Semiconductor |
| 3765 |
DP-24 |
DUAL-IN-LINE Plastic DP24 Packaging information |
Hitachi Semiconductor |
| 3766 |
DP-28 |
DUAL-IN-LINE Plastic DP28 Packaging information |
Hitachi Semiconductor |
| 3767 |
DRB |
90 Solder Dip |
Yamaichi Electronics |
| 3768 |
E208931_HSC278 |
Silicon Schottky Barrier Diode |
Hitachi Semiconductor |
| 3769 |
E602204_HD64413A |
SuperH RISC engine Peripheral LSI |
Mitsubishi Electric Corporation |
| 3770 |
E7000 SH7604 |
Emulator User�s Manual |
Hitachi Semiconductor |
| 3771 |
E702196_SH7750 |
Hitachi Microcomputer Development Environment System SH7750 E10A Emulator |
Mitsubishi Electric Corporation |
| 3772 |
E702196_SH7750 |
Hitachi Microcomputer Development Environment System SH7750 E10A Emulator |
Mitsubishi Electric Corporation |
| 3773 |
E702311_H8S2160B |
H8S/2160B Series Expansion I/O Board |
Hitachi Semiconductor |
| 3774 |
E702336_SH7043 |
SH7043 Series FP-144 User System Interface Cable |
Hitachi Semiconductor |
| 3775 |
E702360_SH7058 |
Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. |
Renesas |
| 3776 |
E702360_SH7058 |
Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. |
Renesas |
| 3777 |
EB4 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 3778 |
EB6 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 3779 |
EB7 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
| 3780 |
EB8 HI TEMP |
High Temp (Glass Reinforced), Dual Readout, High Reliability Copper-Nickel-Tin Alloy Contacts or Gold Contacts, Recognized Under the Component Program of Underwriters' Laboratories Inc (File E65524) |
Vishay |
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