| No. |
Part Name |
Description |
Manufacturer |
| 61 |
DF18E-30DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 62 |
DF18E-30DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 63 |
DF18E-40DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 64 |
DF18E-40DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 65 |
DF18E-50DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 66 |
DF18E-50DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 67 |
DF18E-60DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 68 |
DF18E-60DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 69 |
DF18E-70DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 70 |
DF18E-70DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 71 |
DF18E-80DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 72 |
DF18E-80DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 73 |
ENA1604 |
P-Channel Power MOSFET, -40V, -70A, 10.4mOhm, Single ATPAK |
ON Semiconductor |
| 74 |
FCD4B14 |
500 dpi, 0.4mm x 14 mm Digital Fingerprint Linear Sensor, 2240 Pixels (8 x 280) Image Array, Digital Output (On-chip) Package. |
Atmel |
| 75 |
FH16-60S-0.3SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 76 |
FH16-80S-0.3SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 77 |
FH16-90S-0.3SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 78 |
FH16H-50S-0.5SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 79 |
FH16M-80S-0.4SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 80 |
FH16M-96S-0.4SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 81 |
FH16P-64S-0.5SHW |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
Hirose Electric |
| 82 |
FHP3131 |
0.4mA, 2.5V to 12V, 70MHz Rail-to-Rail Amplifier |
Fairchild Semiconductor |
| 83 |
IPD12N03L |
OptiMOS Power MOSFET, 30V, DPAK, RDSon = 10.4mOhm, 30A, LL |
Infineon |
| 84 |
IPU12N03L |
OptiMOS Power MOSFET, 30V, TO251, RDSon = 10.4mOhm, 30A, LL |
Infineon |
| 85 |
MAX77178 |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
| 86 |
MAX77178EVKIT# |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
| 87 |
MAX77178EWC+ |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
| 88 |
MAX77178EWC+T |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
| 89 |
MAX77179 |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
| 90 |
MAX77179EWC+ |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
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