| No. |
Part Name |
Description |
Manufacturer |
| 91 |
MAX77179EWC+T |
High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP |
MAXIM - Dallas Semiconductor |
| 92 |
PS2761 |
Photocoupler with 0.4mm insulation distance(LED: DC input) |
NEC |
| 93 |
PS2761-1-E3 |
Photocoupler with 0.4mm insulation distance(LED: DC input) |
NEC |
| 94 |
PS2761-1-E4 |
Photocoupler with 0.4mm insulation distance(LED: DC input) |
NEC |
| 95 |
PS2765 |
Photocoupler with 0.4mm insulation distance(LED: AC input) |
NEC |
| 96 |
PS2765-1-E3 |
Photocoupler with 0.4mm insulation distance(LED: AC input) |
NEC |
| 97 |
PS2765-1-E4 |
Photocoupler with 0.4mm insulation distance(LED: AC input) |
NEC |
| 98 |
SPD30N03S2L-10 |
Low Voltage MOSFETs - OptiMOS Power MOSFET, 30V, DPAK, RDSon = 10.4mOhm, 30A, LL |
Infineon |
| 99 |
TPS626765 |
650mA, 6-MHz High-Efficiency, 0.4mm Profile Chip Scale Package, Step-Down Converter, Vout=1.05V 6-DSBGA -40 to 85 |
Texas Instruments |
| 100 |
TPS626765YFDR |
650mA, 6-MHz High-Efficiency, 0.4mm Profile Chip Scale Package, Step-Down Converter, Vout=1.05V 6-DSBGA -40 to 85 |
Texas Instruments |
| 101 |
TPS626765YFDT |
650mA, 6-MHz High-Efficiency, 0.4mm Profile Chip Scale Package, Step-Down Converter, Vout=1.05V 6-DSBGA -40 to 85 |
Texas Instruments |
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